Electronic module

ABSTRACT

The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

BACKGROUND 1. Technical Field

The present disclosure relates generally to an electronic module, andmore particularly to an electronic module used in wirelesscommunications.

2. Description of the Related Art

In full-duplex communication technology, duplexing devices are commonlyused in wireless communication equipment to allow multi-directionalsignal communication over a single path at any given time. The duplexingdevice isolates the transmitting part (TX) and the receiving part (RX)and allows the TX and RX to use the same antenna.

As wireless communication equipment becomes more compact (or when moredevices are incorporated in a same wireless communication equipment),the TX and RX may be disposed in close proximity. Undesirableinterference when operating the TX and RX simultaneously presents aproblem.

SUMMARY

In some arrangements, an electronic module includes a circuit includinga transmitting part and a receiving part physically separated from thetransmitting part. The electronic module also includes an elementisolated from the circuit and configured to block electricalinterference between the transmitting part and the receiving part.

In some arrangements, an electronic module includes a supporting elementincluding a first surface and a second surface opposite to the firstsurface. The electronic module also includes a transmitting partsupported by the first surface of the supporting element and a receivingpart supported by the second surface of the supporting element. Theelectronic module also includes an antenna part adjacent to thereceiving part and configured to receive a first signal from thetransmitting part and configured to transmit a second signal to thereceiving part.

In some arrangements, an electronic module includes a first carrier, asecond carrier physically separated from the first carrier, and aduplexing device including a transmitting part adjacent to the firstcarrier and a receiving part adjacent to the second carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are readily understood from thefollowing detailed description when read with the accompanying figures.It should be noted that various features may not be drawn to scale. Thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 illustrates a cross-sectional view of an electronic module inaccordance with some arrangements of the present disclosure.

FIG. 2 illustrates a functional block diagram of an electronic module inaccordance with some arrangements of the present disclosure.

FIG. 3 illustrates a cross-sectional view of an electronic module inaccordance with some arrangements of the present disclosure.

FIG. 4 illustrates a top view of an electronic module in accordance withsome arrangements of the present disclosure.

FIG. 5 illustrates a top view of an electronic module in accordance withsome arrangements of the present disclosure.

FIG. 6 illustrates a top view of an electronic module in accordance withsome arrangements of the present disclosure.

FIG. 7 illustrates a top view of an electronic module in accordance withsome arrangements of the present disclosure.

FIG. 8 illustrates a cross-sectional view of an electronic module inaccordance with some arrangements of the present disclosure.

Common reference numerals are used throughout the drawings and thedetailed description to indicate the same or similar elements. Thepresent disclosure will be more apparent from the following detaileddescription taken in conjunction with the accompanying drawings.

DETAILED DESCRIPTION

The following disclosure provides many different arrangements, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow. These are, of course, merely examples and are not intended to belimiting. In the present disclosure, reference to the formation of afirst feature over or on a second feature in the description thatfollows may include arrangements in which the first and second featuresare formed in direct contact, and may also include arrangements in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact.Besides, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for simplicity andclarity and does not in itself dictate a relationship between thevarious arrangements and/or configurations discussed.

Arrangements of the present disclosure are discussed in detail below. Itshould be appreciated, however, that the present disclosure providesmany applicable concepts that can be embodied in a wide variety ofspecific contexts. The specific arrangements discussed are merelyillustrative and do not limit the scope of the disclosure.

FIG. 1 illustrates a cross-sectional view of an electronic module 1 inaccordance with some arrangements of the present disclosure. In somearrangements, the electronic module 1 may be or include a duplexingdevice used in wireless communications. In some arrangements, theelectronic module 1 may include a substrate 10, a receiving part 11, atransmitting part 12, an antenna part 13, a shielding structure 14, acontrolling device 15, and encapsulants 16, 16′. In some arrangements,the electronic module 1 may include a semiconductor device or asemiconductor device package.

In some arrangements, the substrate 10 may be or include, for example, aprinted circuit board (PCB) (such as a paper-based copper foillaminate), a composite copper foil laminate, a polymer-impregnatedglass-fiber-based copper foil laminate, or so on. The substrate 10 mayhave a surface 101 and a surface 102 opposite to the surface 101. Insome arrangements, the substrate 10 may include a redistribution layer(RDL), a grounding element, a feeding line, a conductive transmissionline, or other conductive structures. In some arrangements, thesubstrate 10 may include an electrical contact 10 e on the surface 102for providing electrical connections between the electronic module 1 andan external device (e.g., a PCB, an electronic device, anotherelectronic module, and so on). The electrical contact 10 e may include asolder ball, such as a controlled collapse chip connection (C4) bump, aball grid array (BGA) or a land grid array (LGA). In some arrangements,the substrate 10 may include one or more supporting elements or one ormore carrier configured to support the receiving part 11, thetransmitting part 12, and the antenna part 13.

In some arrangements, each of the receiving part 11, the transmittingpart 12, and the antenna part 13 may be a chip or a die including asemiconductor substrate, one or more integrated circuit devices, and oneor more overlying interconnection structures therein. The integratedcircuit devices may include active devices such as transistors and/orpassive devices such as resistors, capacitors, inductors, or acombination thereof.

In some arrangements, each of the receiving part 11, the transmittingpart 12, and the antenna part 13 may be a path or a port. In somearrangements, the receiving part 11 may be connected with a receiver ora receiving part of a transceiver (such as the receiving part RX of thetransceiver 21 in FIG. 2 ). In some arrangements, the transmitting part12 may be connected with a transmitter or a transmitting part of atransceiver (such as the transmitting part TX of the transceiver 21 inFIG. 2 ). In some arrangements, the antenna part 13 may be connectedwith an antenna (such as the antenna 22 in FIG. 2 ).

In some arrangements, one or more of the receiving part 11, thetransmitting part 12, and the antenna part 13 may be partially embeddedin the substrate 10. In some arrangements, one or more of the receivingpart 11, the transmitting part 12, and the antenna part 13 may bepartially exposed from the substrate 10 as shown. In other arrangements,one or more of the receiving part 11, the transmitting part 12, and theantenna part 13 may be entirely embedded in the substrate 10, such thatno part of one or more of the receiving part 11, the transmitting part12, and the antenna part 13 is exposed from the substrate 10.

In some arrangements, the receiving part 11 may be disposed on thesurface 101 of the substrate 10. In some arrangements, the receivingpart 11 may be adjacent to the surface 101 of the substrate 10. In somearrangements, the receiving part 11 and the transmitting part 12 may bedisposed on opposite sides of the substrate 10. For example, thetransmitting part 12 may be disposed on the surface 102 of the substrate10. For example, the transmitting part 12 may be adjacent to the surface102 of the substrate 10. In some arrangements, the receiving part 11 andthe transmitting part 12 may be physically spaced apart with a gaptherebetween. In some arrangements, the receiving part 11 may bephysically separated from the transmitting part 12. For example, thereceiving part 11 and the transmitting part 12 may be separated by thesubstrate 10 as shown. In other arrangements, the receiving part 11 andthe transmitting part 12 may be disposed on the same side of thesubstrate 10 (for example, as described in FIGS. 4, 5, 6 , and 7). Forexample, the receiving part 11 and the transmitting part 12 may bedisposed side-by-side on the surface 101 or the surface 102. In thearrangements in which the receiving part 11 and the transmitting part 12are disposed on the same side of the substrate 10, the receiving part 11may be physically separated from and spaced apart with the transmittingpart 12 with a gap therebetween.

In some arrangements, the antenna part 13 and the receiving part 11 maybe disposed on the same side of the substrate 10. For example, theantenna part 13 may be disposed on the surface 101 of the substrate 10.In some arrangements, the antenna part 13 and the receiving part 11 maybe integrated. For example, the antenna part 13 and the receiving part11 may be integrated on the surface 101 of the substrate 10. Forexample, the antenna part 13 and the receiving part 11 may be integratedon the same carrier. For example, as shown in FIG. 5 , the antenna part13 and the receiving part 11 may be integrated on (e.g., embedded in,contacting, coupled to, attached to, and so on) the same carrier 11 a.The carrier 11 a may be a part of the substrate 10 or may be a carrierphysically separated from the substrate 10.

In some arrangements, the receiving part 11, the transmitting part 12,and the antenna part 13 may be electrically connected through thesubstrate 10. For example, the receiving part 11, the transmitting part12, and the antenna part 13 may be electrically connected through aconductive transmission line (not shown), such as a microstrip line inthe substrate 10.

In some arrangements, the receiving part 11 and the transmitting part 12may be configured to conduct electronic signals having a substantiallysame frequency and/or bandwidth. In some arrangements, the receivingpart 11 and the transmitting part 12 may be configured to conductelectronic signals having different frequencies or bandwidths. In somearrangements, the transmitting part 12 and the receiving part 11 may usethe same antenna part 13. For example, wireless transmission and thereception of the electromagnetic waves may be performed through the sameantenna part 13.

In some arrangements, the shielding structure 14 may be disposed betweenthe receiving part 11 and the transmitting part 12. In somearrangements, the shielding structure 14 may extend in a directionsubstantially parallel to the surface 101 and/or the surface 102 of thesubstrate 10. In some arrangements, the shielding structure 14 may bestacked on the transmitting part 12. In some arrangements, the receivingpart 11 may be stacked on the shielding structure 14. In somearrangements, the shielding structure 14 may be configured to preventelectromagnetic interference (EMI) between the receiving part 11 and thetransmitting part 12. In some arrangements, the shielding structure 14may be configured to block electrical interference between the receivingpart 11 and the transmitting part 12. In some arrangements, theshielding structure 14 may be disposed within the substrate 10 as shown.In some arrangements, the shielding structure 14 may include a groundingelement or a grounding layer in the substrate 10. For example, thegrounding layer in the substrate 10 may function to prevent EMI andblock electrical interference between the receiving part 11 and thetransmitting part 12. In some arrangements, the shielding structure 14may include be any number of grounding layer in the substrate 10. Insome arrangements, the shielding structure 14 may include an elementisolated from the receiving part 11 and the transmitting part 12. Inother words, the shielding structure 14 may be not electricallyconnected to either the receiving part 11 or the transmitting part 12.

In some arrangements, the controlling device 15 may be disposed on thesurface 101 of the substrate 10. In some other arrangements, thecontrolling device 15 may be disposed on the surface 102 of thesubstrate 10. In some other arrangements, the controlling device 15 maybe disposed outside of the electronic module 1 (as shown in FIG. 8 ).

In some arrangements, the controlling device 15 may be electricallyconnected to the substrate 10 (e.g., to the conductive structuresthereof) by flip-chip or wire-bonding. In some arrangements, thecontrolling device 15 may be electrically connected to the receivingpart 11 through the substrate 10. For example, the controlling device 15may be electrically connected to the receiving part 11 through aconductive transmission line, such as a microstrip line in the substrate10. In some arrangements, the controlling device 15 may be electricallyconnected to the transmitting part 12 through the substrate 10. Forexample, the controlling device 15 may be electrically connected to thetransmitting part 12 through a conductive transmission line, such as amicrostrip line in the substrate 10.

In some arrangements, the controlling device 15 may be a chip or a dieincluding a semiconductor substrate, one or more integrated circuitdevices and one or more overlying interconnection structures therein.The integrated circuit devices may include active devices such astransistors and/or passive devices such as resistors, capacitors,inductors, or a combination thereof. In some arrangements, thecontrolling device 15 may be configured to control the conduction of theelectronic signals of the transmitting part 12 and the receiving part11, further described in FIG. 2 .

In some arrangements, the encapsulant 16 may be disposed on the surface101 of the substrate 10 and covers or surrounds the components locatedon or adjacent to the surface 101 of the substrate 10, including thereceiving part 11, the antenna part 13, and the controlling device 15 asshown. In some arrangements, the encapsulant 16′ may be disposed on thesurface 102 of the substrate 10 and covers or surrounds the componentslocated on or adjacent to the surface 102, including the transmittingpart 12 as shown. In some arrangements, the encapsulant 16 and/or theencapsulant 16′ may be physically isolated from the shielding structure14. For example, the encapsulant 16 and/or the encapsulant 16′ may bephysically isolated or separate from the shielding structure 14 by thesubstrate 10, such that the substrate 10 is between the shieldingstructure 14 and the encapsulants 16 and/or 16′. In some arrangements,the antenna part 13 may be at least partially exposed from theencapsulant 16. In some arrangements, the electrical contact 10 e may beat least partially exposed from the encapsulant 16′. In an example, asshown, the electrical contact 10 e is exposed in a concave space definedby the encapsulant 16′. In other arrangements, the encapsulant 16 and/orthe encapsulant 16′ may be omitted.

In some arrangements, each of the encapsulant 16 and the encapsulant 16′may include an epoxy resin having fillers, a molding compound (e.g., anepoxy molding compound or other molding compound), a polyimide, aphenolic compound or material, a material with a silicone dispersedtherein, or a combination thereof.

FIG. 2 illustrates a functional block diagram of an electronic module inaccordance with some arrangements of the present disclosure. In somearrangements, the function of the electronic module 1 in FIG. 1 may be apart of the functional block diagram in FIG. 2 . The functional blockdiagram may include a duplexing device 20, a transceiver 21, an antenna22, and a controlling device 23. In some arrangements, an example of theduplexing device 20 is the electronic module 1 in FIG. 1 .

The transceiver 21 may have a transmitting part TX connected to a port(such as the transmitting part 12 of the electronic module 1) of theduplexing device 20 through a power amplifier (PA) 24. In somearrangements, the transmitting part TX may be configured to output anelectronic signal (such as a transmission signal) to the duplexingdevice 20. The electronic signal may be conducted through the PA 24 anda transmission path (such as the transmitting part 12 of the electronicmodule 1). The transceiver 21 may have a receiving part RX connected toa port (such as the receiving part 11 of the electronic module 1) of theduplexing device 20 through a low-noise amplifier (LNA) 25. In somearrangements, the receiving part RX may be configured to receive anelectronic signal (such as a reception signal) from the duplexing device20. The electronic signal may be conducted through a reception path(such as the receiving part 11 of the electronic module 1) and the LNA25. In some arrangements, the electronic signals in the transmissionpath and the reception path may have a substantially same frequencyand/or bandwidth. In some arrangements, the electronic signals in thetransmission path and the reception path may have different frequenciesand/or bandwidths. In some arrangements, the transceiver 21 may includea combination of a transmitter and a receiver. In some arrangements, thetransceiver 21 may include a transmitter and a receiver physicallyseparated from each other.

The antenna 22 may be connected to a port (such as the antenna part 13)of the duplexing device 20. In some arrangements, the antenna 22 mayinclude a patch antenna, a chip antenna, an inverted-F antennas, or soon. In some arrangements, the antenna 22 may be configured to emit atransmission signal from the transmitting part TX in the form ofelectromagnetic waves and catch or require a desired reception signalout of electromagnetic waves. The receiving part RX and the transmittingpart TX of the transceiver 21 may not directly connect to the antenna22. The receiving part RX and the transmitting part TX of thetransceiver 21 may connect to the antenna 22 through the duplexingdevice 20. In other words, the receiving part RX and the transmittingpart TX may connect to the antenna 22 through a circuit including thereceiving part 11, the transmitting part 12, and the antenna part 13 inFIG. 1 . The receiving part RX and the transmitting part TX may use thesame antenna 22. For example, the transmission and the reception of theelectromagnetic waves may be conducted through the same antenna 22.

The controlling device 23 may connect to each of the duplexing device20, the transceiver 21, and the antenna 22. In some arrangements, thecontrolling device 23 may be configured to control the duplexing device20. For example, the controlling device 23 may generate a control signalto control the duplexing device 20. In some arrangements, thecontrolling device 23 may be configured to control the transmission andthe reception of the electromagnetic waves.

The duplexing device 20 may have three ports connected with thetransmitting part TX, the receiving part RX, and the antenna 22. In somearrangements, the duplexing device 20 may be the circuit between thetransmitting part TX, the receiving part RX, and the antenna 22. In somearrangements, the duplexing device 20 may be responsive to a controlsignal generated from the controlling device 23.

In some arrangements, the electronic signals from the PA 24 to theantenna 22 through the duplexing device 20 (such as through thetransmitting part 12 of the electronic module 1 in FIG. 1 ) and theelectronic signals from the antenna 22 to the LNA 25 through theduplexing device 20 (such as through the receiving part 11 of theelectronic module 1 in FIG. 1 ) may be substantially conducted at thesame time without interfering with each other. In some arrangements, theduplexing device 20 may be configured to allow multi-directional signalcommunication (e.g., for transmission and reception) over a single path.For example, in the duplexing device 20, a first path is configured toconduct a first electronic signal from the transmitting part TX to theantenna 22 and a second path is configured to conduct a secondelectronic signal from the antenna 22 to the receiving part RX. In somearrangements, the first signal and the second signal may be conducted atthe same time. In some arrangements, the frequency of the first signaland the frequency of the second signal may be substantially the same. Insome arrangements, the duplexing device 20 may be configured to performa full duplex operation. In some arrangements, the duplexing device 20may include a circulator. In some arrangements, the duplexing device 20may have a circuit that functions as a circulator.

For example, the controlling device 23 may be configured to generate acontrol signal to control the duplexing device 20 to allowmulti-directional signal communication over a single path. For example,the controlling device 23 may be configured to generate a control signalto control the duplexing device 20 to perform a full duplex operation.For example, the controlling device 23 may be configured to generate acontrol signal to control the duplexing device 20 to function as acirculator.

For example, the controlling device 23 may be configured to provide asingle path from the transmitting part TX to the antenna 22 through theduplexing device 20.

For example, the controlling device 23 may be configured to provide asingle path from the receiving part RX to the transmitting part TXthrough the duplexing device 20.

For example, the controlling device 23 may be configured to prevent adirect path from the transmitting part TX to the receiving part RXthrough the duplexing device 20.

For example, the controlling device 23 may be configured to control theduplexing device 20 to route signals from the transmitting part TX tothe antenna 22 and from the antenna 22 to the receiving part RX, withoutallowing signals to pass directly from the transmitting part TX to thereceiving part RX.

In some other arrangements, the controlling device 23 may be omitted.For example, the electronic signals from the PA 24 to the antenna 22through the duplexing device 20 and the electronic signals from theantenna 22 to the LNA 25 through the duplexing device 20 may besubstantially conducted at the same time without interfering with eachother with or without the controlling device 23. For example, theduplexing device 20 may be configured to allow multi-directional signalcommunication (e.g., for transmission and reception) over a single pathwith or without the controlling device 23.

In an example, to enhance degree of isolation between the transmittingpart TX and the receiving part RX, a circulator may be inserted, such asbetween the PA 24 and the duplexing device 20. However, such anadditional circulator may increase the weight and the cost and mayfurther increase insertion loss from the transmitting part TX to theantenna 22 and/or from the antenna 22 to the receiving part RX.

According to some arrangements of the present disclosure, thetransmitting part and the receiving part of the duplexing device 200 areintegrated in (e.g., embedded in, contacting, coupled to, attached to,and so on) an electronic module and isolated by a shielding structure.For example, in FIG. 1 , the transmitting part 12 and the receiving part11 are integrated in the electronic module 1 and are isolated by theshielding structure 14. The package size of the electronic module 1 maybe reduced.

The degree of isolation between the transmitting part TX and thereceiving part RX (e.g., the transmitting part 12 and the receiving part11) may be enhanced. For example, self-interference in full-duplexcommunication may be alleviated or eliminated. In addition, theshielding structure (e.g., the shielding structure 14) provides simplerand cheaper isolation than the addition of another circulator. Lowinsertion loss from the transmitting part TX of the transceiver 21 tothe antenna 22 and/or from the antenna 22 to the receiving part RX ofthe transceiver 21 may be achieved while providing high isolation fromthe transmitting part TX to the receiving part RX.

FIG. 3 illustrates a cross-sectional view of an electronic module 3 inaccordance with some arrangements of the present disclosure. Theelectronic module 3 of FIG. 3 is similar to the electronic module 1 ofFIG. 1 , and the differences therebetween are described below.

In some arrangements, as shown in FIG. 3 , the receiving part 11 may bedisposed on or adjacent to the surface 102 of the substrate 10 and thetransmitting part 12 may be disposed on or adjacent to the surface 101of the substrate 10.

In some arrangements, the antenna part 13 may be disposed on or adjacentto the surface 101 of the substrate 10. In some arrangements, theantenna part 13 and the transmitting part 12 may be disposed on the sameside of the substrate 10. In some arrangements, the antenna part 13 andthe transmitting part 12 may be integrated. For example, the antennapart 13 and the transmitting part 12 may be integrated on the surface101 of the substrate 10. For example, the antenna part 13 and thetransmitting part 12 may be integrated on (e.g., embedded in,contacting, coupled to, attached to, and so on) the same carrier. Forexample, as shown in FIG. 7 , the antenna part 13 and the transmittingpart 12 may be integrated on the same carrier 12 a. The carrier 12 a maybe a part of the substrate 10 or may be a carrier physically separatedfrom the substrate 10.

FIG. 4 illustrates a top view of an electronic module in accordance withsome arrangements of the present disclosure. In some arrangements, FIG.4 illustrates a relative locations among the elements in the electronicmodule 1 of FIG. 1 .

In FIG. 4 , the receiving part 11 may be disposed on a carrier 11 a, thetransmitting part 12 may be disposed on a carrier 12 a, and the antennapart 13 may be disposed on a carrier 13 a. In some arrangements, thecarrier 11 a, the carrier 12 a, and the carrier 13 a may be physicallyspaced apart from one another with a gap therebetween. In somearrangements, the shielding structure 14 may be disposed between thecarrier 11 a and the carrier 12 a.

In some arrangements, the carrier 11 a may not directly contact thecarrier 12 a. In some arrangements, the carrier 11 a may not indirectlycontact the carrier 12 a. In some arrangements, the carrier 11 a may bespaced apart from the carrier 12 a. In some arrangements, the carrier 11a may be adjacent to the carrier 12 a. In some arrangements, a surfaceof the carrier 11 a on which the receiving part 11 is disposed may beadjacent to a surface of the carrier 12 a on which the transmitting part12 is disposed.

In some arrangements, the distance “D1” between the receiving part 11and the antenna part 13 may be different from the distance “D2” betweenthe transmitting part 12 and the antenna part 13. For example, thedistance D2 may be greater than the distance D1. For example, thedistance D2 may exceed the distance D1. The distance D1 may be less thanthe distance D2. The distance D1 may include the shortest distancebetween the receiving part 11 and the antenna part 13, the distancebetween two closest points of the receiving part 11 and the antenna part13, or the distance between the centers of the receiving part 11 and theantenna part 13. The distance D2 may include the shortest distancebetween the transmitting part 12 and the antenna part 13, the distancebetween two closest points of the transmitting part 12 and the antennapart 13, or the distance between the centers of the transmitting part 12and the antenna part 13. In some arrangements, since electromagneticwaves attenuated when passing through mediums (such as air), the energyof the electromagnetic waves received by the antenna (such as theantenna 22 in FIG. 2 ) may be weak. In some arrangements, by arrangingthe antenna part 13 close to the receiving part 11, signal loss betweenthe antenna (such as the antenna 22 in FIG. 2 ) and the receiving part11 may be alleviated. On the other hand, the transmitting part 12 isconfigured to conduct electronic signals which is amplified (such as bythe PA in FIG. 2 ), the signal loss between the transmitting part 12 andthe antenna part 13 is not as severe as the signal loss between thereceiving part 11 and the antenna part 13 is.

In some arrangements, the surface of the carrier 11 a on which thereceiving part 11 is disposed and the surface of the carrier 12 a onwhich the transmitting part 12 is disposed may face the same direction.For example, the carrier 11 a and the carrier 12 a may be disposed onthe same side of the carrier 11 a and the carrier 12 a. For example, thesurface of the carrier 11 a on which the receiving part 11 is disposedand the surface of the carrier 12 a on which the transmitting part 12 isdisposed may be parallel.

In other arrangements, the surface of the carrier 11 a on which thereceiving part 11 is disposed and the surface of the carrier 12 a onwhich the transmitting part 12 is disposed may face differentdirections. For example, the carrier 11 a and the carrier 12 a may bedisposed on different sides of the carrier 11 a and the carrier 12 a.For example, the surface of the carrier 11 a on which the receiving part11 is disposed may be angled with or non-parallel to the surface of thecarrier 12 a on which the transmitting part 12 is disposed.

In some arrangements, the carrier 11 a may be a part of the substrate 10in FIG. 1 or may be a carrier physically separated from the substrate10. In some arrangements, the carrier 12 a may be a part of thesubstrate 10 in FIG. 1 or may be a carrier physically separated from thesubstrate 10. In some arrangements, the carrier 13 a may be a part ofthe substrate 10 in FIG. 1 or may be a carrier physically separated fromthe substrate 10. In some arrangements, the carrier 11 a and the carrier12 a may be at different circuit layers or different dielectric layersin the substrate 10. For example, the carrier 11 a and the carrier 12 amay be at different elevations with respect to the surface 102 in thesubstrate 10. For example, in FIG. 3 , the carrier 11 a may be or may beat a dielectric layer closer to the surface 102 and the carrier 12 a maybe or may be at a dielectric layer closer to the surface 101.

FIG. 5 illustrates a top view of an electronic module in accordance withsome arrangements of the present disclosure. In some arrangements, FIG.5 illustrates a relative locations among the elements in the electronicmodule 1 of FIG. 1 . The top view of FIG. 5 is similar to the top viewof FIG. 4 , and the differences therebetween are described below.

In FIG. 5 , the receiving part 11 and the antenna part 13 may beintegrated in (e.g., embedded in, contacting, coupled to, attached to,and so on) the same carrier 11 a, and the carrier 13 a in FIG. 4 isomitted. The carrier 11 a may be a part of the substrate 10 in FIG. 1 ormay be a carrier physically separated from the substrate 10.

FIG. 6 illustrates a top view of an electronic module in accordance withsome arrangements of the present disclosure. In some arrangements, FIG.6 illustrates a relative locations among the elements in the electronicmodule 1 of FIG. 1 . The top view of FIG. 6 is similar to the top viewof FIG. 4 , and the differences therebetween are described below.

In FIG. 6 , the distance D1′ between the receiving part 11 and theantenna part 13 is greater than the distance D2′ between thetransmitting part 12 and the antenna part 13. For example, the distanceD1′ may exceed the distance D2′. The distance D2′ may be less than thedistance D1′. The distance D1′ may include the shortest distance betweenthe receiving part 11 and the antenna part 13, the distance between twoclosest points of the receiving part 11 and the antenna part 13, or thedistance between the centers of the receiving part 11 and the antennapart 13. The distance D2′ may include the shortest distance between thetransmitting part 12 and the antenna part 13, the distance between twoclosest points of the transmitting part 12 and the antenna part 13, orthe distance between the centers of the transmitting part 12 and theantenna part 13

FIG. 7 illustrates a top view of an electronic module in accordance withsome arrangements of the present disclosure. In some arrangements, FIG.7 illustrates a relative locations among the elements in the electronicmodule 1 of FIG. 1 . The top view of FIG. 7 is similar to the top viewof FIG. 4 , and the differences therebetween are described below.

In FIG. 7 , the transmitting part 12 and the antenna part 13 may beintegrated in the same carrier 12 a, and the carrier 13 a in FIG. 4 isomitted. The carrier 12 a may be a part of the substrate 10 in FIG. 1 ormay be a carrier physically separated from the substrate 10.

FIG. 8 illustrates a cross-sectional view of an electronic module 8 inaccordance with some arrangements of the present disclosure. Theelectronic module 8 of FIG. 8 is similar to the electronic module 1 ofFIG. 1 , and the differences therebetween are described below.

The electronic module 8 may include the electronic module 1 in FIG. 1 ,a substrate 80, and a circuit region 81.

The electronic module 1 and the circuit region 81 may be disposed on thesubstrate 80. The electronic module 1 and the circuit region 81 may bephysically separated with a gap (filled by the substrate 80)therebetween. The electronic module 1 and the circuit region 81 may beelectrically connected through the substrate 80.

In some arrangements, the circuit region 81 may include the controllingdevice 15 in FIG. 1 . In some arrangements, the circuit region 81 mayinclude the LNA 25 and/or the PA 24 in FIG. 2 . In some arrangements,the circuit region 81 may include the transceiver 21 in FIG. 2 . In somearrangements, the circuit region 81 may include the controlling device22 in FIG. 2 . In some arrangements, the circuit region 81 may includethe controlling device 23 in FIG. 2 .

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” “left,” “right” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation, in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly. It should be understoodthat when an element is referred to as being “connected to” or “coupledto” another element, it may be directly connected to or coupled to theother element, or intervening elements may be present.

As used herein, the terms “approximately”, “substantially”,“substantial” and “about” are used to describe and account for smallvariations. When used in conduction with an event or circumstance, theterms can refer to instances in which the event or circumstance occursprecisely as well as instances in which the event or circumstance occursto a close approximation. As used herein with respect to a given valueor range, the term “about” generally means within ±10%, ±5%, ±1%, or±0.5% of the given value or range. Ranges can be expressed herein asfrom one endpoint to another endpoint or between two endpoints. Allranges disclosed herein are inclusive of the endpoints unless specifiedotherwise. The term “substantially coplanar” can refer to two surfaceswithin micrometers (μm) of lying along the same plane, such as within 10μm, within 5 μm, within 1 μm, or within 0.5 μm of lying along the sameplane. When referring to numerical values or characteristics as“substantially” the same, the term can refer to the values lying within±10%, ±5%, ±1%, or ±0.5% of an average of the values.

The foregoing outlines features of several arrangements and detailedaspects of the present disclosure. The arrangements described in thepresent disclosure may be readily used as a basis for designing ormodifying other processes and structures for carrying out the same orsimilar purposes and/or achieving the same or similar advantages of thearrangements introduced herein. Such equivalent constructions do notdepart from the spirit and scope of the present disclosure, and variouschanges, substitutions, and alterations may be made without departingfrom the spirit and scope of the present disclosure.

What is claimed is:
 1. An electronic module, comprising: a duplexingdevice including a transmitting part and a receiving part; a firstcarrier having a top surface and a bottom surface, wherein thetransmitting part is disposed adjacent to one of the top surface and thebottom surface and the receiving part is disposed adjacent to the otherone of the top surface and the bottom surface; and an element configuredto block electrical interference between the transmitting part and thereceiving part; a first encapsulant disposed over the top surface of thefirst carrier and encapsulating the receiving part; and a secondencapsulant disposed under the bottom surface of the first carrier andencapsulating the transmitting part.
 2. The electronic module of claim1, wherein the element is disposed within the first carrier.
 3. Theelectronic module of claim 2, wherein the element comprises a groundinglayer.
 4. The electronic module of claim 3, wherein a width of thegrounding layer is greater than a width of the receiving part or a widthof the transmitting part.
 5. The electronic module of claim 1, whereinthe transmitting part and the receiving part are overlapped in adirection substantially perpendicular to the top surface of the firstcarrier.
 6. The electronic module of claim 5, wherein the element isoverlapped with the transmitting part and the receiving part in thedirection.
 7. The electronic module of claim 1, wherein the duplexingdevice further comprises: an antenna part electrically connected to thereceiving part and the transmitting part, wherein the antenna part isdisposed closer to the receiving part than to the transmitting part. 8.The electronic module of claim 7, wherein the antenna part is disposedover the top surface of the first carrier and electrically connected tothe receiving part and the transmitting part through the first carrier.9. The electronic module of claim 1, wherein the first encapsulant isdisposed between the top surface of the first carrier and the receiverpart, and the second encapsulant is disposed between the bottom surfaceof the first carrier and the transmitting part.
 10. The electronicmodule of claim 1, wherein a lateral surface of the first encapsulant, alateral surface of the second encapsulant, and a lateral surface of thefirst carrier are substantially aligned.
 11. The electronic module ofclaim 1, wherein a thickness of the first encapsulant is greater than athickness of the second encapsulant.
 12. The electronic module of claim1, further comprising: a plurality electrical contacts configured toconnect the electronic module and an external device, wherein the secondencapsulant defines a plurality of openings for accommodating theplurality of electrical contacts respectively.
 13. The electronic moduleof claim 12, wherein the transmitting part is disposed between two ofthe plurality of electrical contacts.
 14. The electronic module of claim12, wherein the duplexing device further comprises an antenna partencapsulated by the first encapsulant and electrically connected to thereceiving part and the transmitting part.
 15. The electronic module ofclaim 1, wherein the receiving part is connected to the top surface ofthe first carrier through a first electrical contact.
 16. The electronicmodule of claim 15, wherein the transmitting part is connected to thebottom surface of the first carrier through a second electrical contact.17. An electronic module, comprising: a duplexing device including atransmitting part and a receiving part; a first carrier having a topsurface and a bottom surface, wherein the transmitting part is disposedadjacent to one of the top surface and the bottom surface and thereceiving part is disposed adjacent to the other one of the top surfaceand the bottom surface; an element configured to block electricalinterference between the transmitting part and the receiving part; and acontrolling device disposed over the first carrier, wherein thecontrolling device is disposed closer to the receiving part than to thetransmitting part, and wherein the controlling device is configured tocontrol the duplexing device to perform a full duplex operation.
 18. Theelectronic module of claim 17, further comprising: an electrical contactdisposed under the bottom surface of the first carrier, wherein theelectrical contact is configured to connect the electronic module and anexternal device, and wherein the electrical contact and the controllingdevice are at least partially overlapped in a cross-sectional view. 19.An electronic module, comprising: a duplexing device including atransmitting part and a receiving part; a first carrier having a topsurface and a bottom surface, wherein the transmitting part is disposedadjacent to one of the top surface and the bottom surface and thereceiving part is disposed adjacent to the other one of the top surfaceand the bottom surface; an element configured to block electricalinterference between the transmitting part and the receiving part; asecond carrier disposed under the first carrier; and an antenna disposedover the second carrier and beside the first carrier, wherein theantenna is electrically connected to the receiving part and thetransmitting part through the second carrier and the first carrier.